According to foreign media reports, Intel's competitiveness in the mobile market has been greatly improved due to the significant progress in design and manufacturing processes compared to the previous generation. The running points of Qualcomm's upcoming Snapdragon 810 chip have been released, and the running points of Intel's new mobile chip will not be disclosed until the Intel Developer Forum (September 9-11). Intel has solved all practical problems - power consumption, packaging and performance. However, factors such as price, GPU (graphics processing unit) performance, and the number of integrated GPU cores will enable Qualcomm to continue to lead before moving to the 16-nanometer process.
Broadwell Core M's technological advancement
The performance improvement of the CPU (Central Processing Unit) is very large. Smaller packaging processes, increased power consumption, fewer instructions per cycle, and lower thermal design power all contribute to the performance of the Broadwell Core M.
Intel's products that use its mobile chips do not require fans by reducing heat generation. This will increase Intel's chances of entering the smartphone and tablet market, as smaller CPUs will help create thinner device designs. For mobile device manufacturers, reducing device thickness is a priority for them, which helps to increase the portability of the device. For years, Intel has been taking steps to reduce energy consumption during GPU idle periods.
Qualcomm Snapdragon 810 chip uses 20 nanometer process, not as good as Intel Broadwell Core M's 14 nanometer process. In terms of graphics processing, Intel's design may not be as good as Qualcomm. But on the CPU side, the author believes that even if Intel's design is slightly inferior, the higher transistor density and the increase in instructions per cycle will provide high enough performance that Intel will not fall in the competition with Qualcomm next year. Under the wind.
The technology blog site GSM Arena reported that "The Snapdragon 810 integrates four Cortex-A57 cores and four Cortex-A53 cores. Compared with the Snapdragon 805 chip, the performance is improved by 25%-55%, and the energy consumption is reduced by 20%. The 810 is equipped with the new Adreno 430 GPU, which is 30% better than the Adreno 420."
Qualcomm plans to compete with Intel through more cores and 20% lower energy consumption. The Adreno 430 is a follow-on to the Adreno 420, and the performance improvement is mainly due to the manufacturing process being upgraded from 28 nm to 20 nm.
State-of-the-art modem chips enable Qualcomm to continue to maintain its competitive edge. Intel's XMM 7260 is inferior to Qualcomm's Gobi 9x35 in performance. The advantages in modem technology make Qualcomm not fully convinced in the face of Intel's manufacturing process. Qualcomm's temporary solution to add more cores to the CPU is not "energy efficient" but will improve performance.
In terms of design, Broadwell Core M has fixed many of Haswell's flaws. Qualcomm has an excellent CPU/GPU/modem solution and a semi-custom design that adds NFC (near-range communication) and wireless charging.
Intel will introduce second-generation FinFET chips, giving more time to develop better CPU/GPU/modem designs. In terms of price and performance, Intel has significantly narrowed the gap with Qualcomm.
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