How to Set the Thermal Resistance of COB?

Release date: 2017-11-02 Source: Foreign station Share:

When performing thermal simulations, it is generally advised not to rely solely on thermal resistance values. Instead, it's better to use the actual thermal conductivity and dimensions of each material involved in the system. This approach provides more accurate and reliable results, especially when dealing with complex structures like COB (Chip-on-Board) assemblies.

For COB simulations, it's essential to create a detailed model that accurately represents the chip, substrate, adhesive layers, and other components. If contact thermal resistance is a concern, it should be individually defined for each chip or interface. The contact resistance can be calculated based on the thermal properties of the materials and the geometry of the contact area.

Understanding and properly modeling thermal resistance is crucial for ensuring the reliability and performance of electronic systems. By taking a more detailed and material-specific approach, engineers can better predict heat distribution and optimize cooling strategies accordingly.

Tag: How to Set the Thermal Resistance of COB?

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