Semiconductor lighting technology is one of the most promising high-tech fields in the 21st century, and Light Emitting Diode ( LED ) is its core technology. A light-emitting diode is a type of light-emitting element that can directly convert electrical energy into light energy, that is, a semiconductor light-emitting device capable of emitting visible light, infrared light, or ultraviolet light when a forward current is applied to a semiconductor pn junction. Because it has low working voltage, low power consumption, high luminous efficiency, short response time, pure light color, firm structure, impact resistance, vibration resistance, stable and reliable performance, light weight, small volume and low cost. The characteristics have thus been widely applied and leaps and bounds.
Since the 1990s, with the rise of third-generation semiconductors represented by gallium nitride, blue, green, and white LEDs have been mass-produced. China has a good technology and industrial base in the field of LED lighting, and has formed an industrial chain from the production of epitaxial wafers, chip preparation, and device packaging integration. At present, there are more than 400 large-scale enterprises engaged in the production of semiconductor LED devices and lighting systems in China. The annual output of ultra-high brightness LED dies of red, orange and yellow has exceeded 1 billion, accounting for about 12% of the world total. It is estimated that by the end of 2010, the global LED market demand will be about 210 billion, the sales will reach 85 billion US dollars, and the value of China's LED industry will exceed 150 billion yuan. At present, LED products have occupied a considerable share in the international market, and packaging materials have also been widely used in LEDs, and their performance has a very important role in the application of LED products.
The LED is composed of a chip, a wire, a bracket, a conductive adhesive, a packaging material, etc., and the package is filled, potted or molded to fill the liquid glue into the device containing the electronic component and the line, at room temperature or heating. Under conditions, it is cured into a thermosetting polymer insulation material having high light transmittance (transmission of a sample having a thickness of 1 mm at a wavelength of 450 nm at a wavelength of more than 99%), high refractive index, high weather resistance, and ultraviolet radiation resistance. It can enhance the integrity of electronic devices, improve the resistance to external shocks and vibrations, improve the insulation between internal components and circuits, avoid linear exposure of components and lines, and improve the waterproof and moisture-proof performance of devices.
The packaging materials currently used mainly include high transparency materials such as epoxy resin, polycarbonate, polymethyl methacrylate, glass, silicone, etc., in which polycarbonate, polymethyl methacrylate and glass are used as outer lens. Materials, epoxy resins and silicones are mainly used as packaging materials and as lens materials.
1 epoxy resin packaging material
Epoxy resin has excellent adhesion, electrical insulation, sealing and dielectric properties, low cost, flexible formulation, easy molding, high production efficiency, and is the mainstream of LED, electronic devices and integrated circuits. material. Epoxy resin refers to a polymer compound containing two or more epoxy groups in the molecule. The epoxy group is more active and can be cross-linked with amines, acid anhydrides, imidazoles, phenolic resins, etc. to form insoluble or not. a high-molecular polymer having a three-dimensional network structure containing a large number of polar groups such as a hydroxyl group, an ether bond, or an amino group, thereby imparting many excellent properties to the material, such as high adhesion, insulation, and resistance. Corrosive and low shrinkage.
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