With the development of semiconductor technology, Moore's Law is close to the edge of failure. The difficulties in the IC design, wafer manufacturing, and packaging testing in the industrial chain are increasing, the technical threshold is getting higher and higher, and the capital investment is getting bigger. The difficulty of covering the entire industrial chain process by a single company has increased significantly. The development of the semi-conductor industry chain toward specialization and refinement of division of labor is an inevitable trend.
The overall growth of the global semiconductor industry has slowed down, industrial structure has been adjusted, and production capacity has been redistributed in the region. Semiconductor industry developed regions and underdeveloped regions will develop differently in the semiconductor industry chain according to their own advantages. The transfer of packaging capacity will continue, and the growth rate of outsourcing packaging and testing industry is expected to surpass the industry.
The technical barriers in the chip design industry and the capital barriers in the wafer manufacturing industry determine that, at this stage, the packaging and testing industry will be the focus of China's semiconductor industry development.
In the traditional packaging process, the cost of gold accounts for the highest proportion. At present, the use of copper wire to replace gold wire is a big trend. The increase in the proportion of shipments of chip products that are bonded with copper wire leads to an increase in the profitability of packaging companies.
The development of semiconductor packages is moving toward the trend of miniaturization and multiple I/O. Specific technological developments include BGAs with multiple I/O pin packages and CSPs with small package sizes. New technologies such as WLSCP and TSV are expected to drive revolutionary advances in chip packaging and testing.
China's domestic packaging and testing companies have their own characteristics: Tongfu Microelectronics enjoys the most direct global capacity transfer; Changjiang Electronics Technology steadily develops and consolidates its leading position in the industry; Huatian Technology Co., Ltd. enjoys the highest gross profit rate while investing through geographical advantages Realize the leap of technology.
China's domestic upstream companies that support packaging companies, such as Kang Qiang and Xinhua Jin, are expected to upgrade their position in the packaging industry.
Risk Warning: The world's leading packaging and testing companies invest directly in mainland China, which will increase competition within the industry. At the same time, rising labor costs will directly affect the profitability of semiconductor packaging companies.
The overall growth of the global semiconductor industry has slowed down, industrial structure has been adjusted, and production capacity has been redistributed in the region. Semiconductor industry developed regions and underdeveloped regions will develop differently in the semiconductor industry chain according to their own advantages. The transfer of packaging capacity will continue, and the growth rate of outsourcing packaging and testing industry is expected to surpass the industry.
The technical barriers in the chip design industry and the capital barriers in the wafer manufacturing industry determine that, at this stage, the packaging and testing industry will be the focus of China's semiconductor industry development.
In the traditional packaging process, the cost of gold accounts for the highest proportion. At present, the use of copper wire to replace gold wire is a big trend. The increase in the proportion of shipments of chip products that are bonded with copper wire leads to an increase in the profitability of packaging companies.
The development of semiconductor packages is moving toward the trend of miniaturization and multiple I/O. Specific technological developments include BGAs with multiple I/O pin packages and CSPs with small package sizes. New technologies such as WLSCP and TSV are expected to drive revolutionary advances in chip packaging and testing.
China's domestic packaging and testing companies have their own characteristics: Tongfu Microelectronics enjoys the most direct global capacity transfer; Changjiang Electronics Technology steadily develops and consolidates its leading position in the industry; Huatian Technology Co., Ltd. enjoys the highest gross profit rate while investing through geographical advantages Realize the leap of technology.
China's domestic upstream companies that support packaging companies, such as Kang Qiang and Xinhua Jin, are expected to upgrade their position in the packaging industry.
Risk Warning: The world's leading packaging and testing companies invest directly in mainland China, which will increase competition within the industry. At the same time, rising labor costs will directly affect the profitability of semiconductor packaging companies.
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