The International Semiconductor Manufacturing Equipment Materials Association (SEMI) announced that in 2010, the global semiconductor materials market increased by 25% from the previous year to reach 43.5 billion US dollars. The material used in the wafer processing (pre-process) process was US$ 17.9 billion, which represents a 29% increase over the previous year, and the material used in the package assembly process (post-process) was US$ 20,630 million, which represents a 21% increase over the previous year. SEMI cited the reasons for the expansion of the material market and listed the market for silicon wafers in the previous process and the advanced packaging material market in the latter process to be substantially expanded.
From a regional point of view, Taiwan, South Korea, and China have recorded growth rates of about 30% growth over the previous year, and other regions have also reached a growth rate of around 20%. SEMI said that due to the high price of gold (Au) used in wire bonding, if the production capacity of the subsequent process is high, the market in the region is expected to expand. The largest market in the world is still Japan, but Taiwan, which is made up of silicon foundry companies and post-process outsourcing companies, continues to grow at a high rate, and its scale is very close to Japan.
The order of the market size by region is as follows: Japan is 9.2 billion U.S. dollars, which is a 20% increase from the previous year, Taiwan is 33.1%, a year-on-year increase of 9.1 billion U.S. dollars, and other regions are a year-on-year increase of 21%. In the US dollar, South Korea’s US$6.2 billion increased by 31% over the previous year, North America’s growth was 19% from the previous year’s US$4.47 billion, and the Chinese mainland’s US$4.15 billion was up 27% over the previous year. The previous year increased by 24% to 3.110 billion U.S. dollars.
From a regional point of view, Taiwan, South Korea, and China have recorded growth rates of about 30% growth over the previous year, and other regions have also reached a growth rate of around 20%. SEMI said that due to the high price of gold (Au) used in wire bonding, if the production capacity of the subsequent process is high, the market in the region is expected to expand. The largest market in the world is still Japan, but Taiwan, which is made up of silicon foundry companies and post-process outsourcing companies, continues to grow at a high rate, and its scale is very close to Japan.
The order of the market size by region is as follows: Japan is 9.2 billion U.S. dollars, which is a 20% increase from the previous year, Taiwan is 33.1%, a year-on-year increase of 9.1 billion U.S. dollars, and other regions are a year-on-year increase of 21%. In the US dollar, South Korea’s US$6.2 billion increased by 31% over the previous year, North America’s growth was 19% from the previous year’s US$4.47 billion, and the Chinese mainland’s US$4.15 billion was up 27% over the previous year. The previous year increased by 24% to 3.110 billion U.S. dollars.
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