Recently, the famous chip company Synopsys (Xinsi Technology) publicly demonstrated USB 3.2 for the first time.
The USB3.2 device and host of this demonstration are based on the HAPS-80 FPGA hardware prototype platform. The physical layer of USB-PHY is manufactured by FinFET process. The single channel bandwidth is 10Gbps, and the dual channel joint transmission can reach the USB3.2 standard of 20Gbps (2.5). GB/s). In terms of transmission speed, USB 3.2 has doubled compared to USB 3.1.
During the demonstration, the average speed of the device was about 1.6GB/s, which was only 2/3 compared to the standard USB3.2 maximum transmission rate. In the subsequent equipment development, major manufacturers have to make considerable efforts.
It is worth mentioning that the USB3.2 protocol will be a convenient and flexible Type-C interface specification as a unified standard. As a result, the previously widely circulated Type-A interface will completely fade out from people's perspective.
Finally, the popularity of the USB 3.2 protocol will take some time, and it is initially expected that no related devices will be available until 2019. And Intel, AMD and other platforms have just completed the initial deployment of USB 3.1 Gen.2, really want to make USB3.2 fully integrated into the major platforms, I believe it will take a long time.
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