With semiconductor revenues expected to reach $11.5 billion in the Internet of Things (IoT) market in 2020, packaging technology will play a more important role in development systems. The review pointed out that system-in-package (SiP) technology, which saves vendor costs, is the most popular.
According to EDN, IoT is regarded as the third wave of technology after PC and mobile phones. Technicians also use the experience and infrastructure from the previous two waves to help achieve various forms of networking. The rapid evolution of discrete packaged semiconductors to integrated circuits (ICs) has also led to the development of scale reduction and increased functionality. In order for IoT to achieve the expected growth, packaging technology is bound to undergo the same scale change.
The review pointed out that low-cost, good heat dissipation and support for Bluetooth low-power (BTLE), Wi-Fi or ZigBee and other standard RF shielding in the package are necessary for common IoT packages. Once the sensor is added, the groove is used. The Cavity package-based solution is the most popular. The IoT package must also be in the production-ready phase, and the footprint must be as small as possible, regardless of whether the solution is separated or integrated.
Because of the size and height limitations of some IoT applications, package requirements have also made system-in-package (SiP) solutions popular, and SiP is the best way to integrate sensors, embedded processors and RF connections. Sensor Fusion allows manufacturers to quickly integrate different technologies without having to spend too much money on new mask settings, giving SiP the advantage of a fast time to market.
SiP also allows manufacturers to create solutions directly from commercially available components, allowing engineers to immediately re-adjust power dissipation to maximize performance. The advantage of SiP is that it can integrate multiple technologies or components into a single package, such as integrating MEMS and CMOS. It is not suitable for traditional ICs in practice, because even if the two components have similarities, they are still very different.
The first is that MEMS components must interact with the environment, so methods that can conduct stimuli must be provided. Second, MEMS components are miniatured differently than CMOS in different processes. Currently, SiP designs are available in wafer-level packages, 2.5D or 3D architectures, flip chip packages, wire bond packages, and package-on-package packages.
MEMS packages have begun to move from quad flat no-lead (QFN) to stacked laminated packages, including recessed main package or hybrid recess packages, while the latter refers to half package encapsulants ( Molding), the other half is the groove of the MEMS component, and the sealant part can withstand more severe environmental conditions.
At present, the packaging design of MEMS, sensors and IoT components is still scattered. After standardization of packaging technology, it is expected to reduce costs and accelerate the adoption of MEMS and enhance the confidence of manufacturers to bring products to market. Commonly available MEMS packaging technologies that can be adopted as industry standards include ChipArray/BGA/LGA, MLF/QFN and SOIC.
MEMS sensors are a key part of the IoT system, but their high adoption rate has eroded the average selling price. One of the solutions for MEMS suppliers is to use sensors to integrate multiple sensors to increase value.
As for SiP solutions, vendors can integrate different technologies and take advantage of commercially available components to reduce costs, and IoT solutions can be further reduced with the integration of packaging technologies.
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