1. The payoff rack is used to intercept the branch cable and measure the position of the main cable branch joint. The protective layer is stripped according to the process requirements, the main conductor is leaked out, and the conductor connection and the injection molded body are prepared.
2. The take-up rack meets the requirements of the user's complete supply.
3. The tug group prevents the main cable or branch cable from rubbing against the ground and damages the cable surface quality.
4. The water cooling system enables the pre-branched cable's injection molded body to cool and shape as soon as possible to prevent bending deformation.
The installation of pre-branch cable equipment should be determined based on the actual conditions of the enterprise and the equipment structure. The injection molding machine we use is the equipment produced by Qingdao Walker Machinery Co., Ltd., and the payoff frame is about 10 meters away from the injection molding machine, and the injection molding machine is on the line. The distance is about 15 meters. Auxiliary equipment is located in it.
The pre-branch cable's process flow chart is as follows:
According to the drawings or on-site measurement - draw the pre-branch cable diagram requires the user to confirm - according to the figure to take off the branch cable and stripped - to determine the location and peeling of the main cable - crimp the main sub-conductor and handle the joint - the device heating, Install the mold, injection - head, test - storage.
Microwave PCB
microwave PCB`s is a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB`s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
The advantages of using materials with a low X, Y and Z CTE is a resulting PCB structure that will remain extremely stable in high temperature environments while operating at up to 40 GHz in analog applications. This allows for the effective placement of very fine pitch components including, in some cases, bare die-attach. Additionally, the low CTE materials will facilitate the alignment of multiple layers and the features they represent in a complex PCB Layout.
Features
.CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
.ER = 3.38/3.48 at 10.0 GHz
.ER is constant to 40.0 GHz
.ED (electro-deposited) copper only
.Layer-to-layer thickness control = +/- 0.001
.Fabrication costs are typical to slightly increased
Microwave PCB
Microwave PCB,Microwave Frequency PCB,Bare Copper Microwave PCB,High Frequency PCB
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